首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Method of manufacturing multilayer interconnection structure
摘要
申请公布号
GB2295723(B)
申请公布日期
1997.03.19
申请号
GB19950024382
申请日期
1995.11.29
申请人
* NEC CORPORATION
发明人
AKIRA * ISOBE
分类号
H01L21/302;H01L21/26;H01L21/3065;H01L21/3105;H01L21/316;H01L21/3205;H01L21/768;H01L23/522;(IPC1-7):H01L21/310
主分类号
H01L21/302
代理机构
代理人
主权项
地址
您可能感兴趣的专利
9-11 Commemorative twin towers with mail box and flags
Hockey puck pet toy
Soccer helmet
Surface configuration of a taillight for a vehicle
India ink container
Electronic questionnaire
Electrosurgical pencil with protected switch and straight proximal end
Golf club head design
Writing instrument with cap
Embossed envelope label
Ideogram for transmitted light illumination functions of a microscope system on a portion of a display panel or microscope display
PDP TV
Guitar amplifier
USB flash memory drive
Pull tab for electrical connector
Vehicle wheel
Hydraulic brake
Watch case
Bottle
Box