发明名称 Conductive ball mounting apparatus
摘要 A suction head has a plurality of suction units. The respective suction units have spaces each connected with a vacuum pump through a first valve. A sensor observes works on a substrate to inspect whether or not a bad mark is marked on the works. The spaces are separated from one another so that only the spaces corresponding to works of good quality with no bad mark are vacuum-evacuated so as to vacuum-suck conductive balls, while preventing the space corresponding to defective work or works with the bad mark from being vacuum-evacuated by closing a first valve so as to cancel the mounting of the conductive balls.
申请公布号 US5983490(A) 申请公布日期 1999.11.16
申请号 US19970888132 申请日期 1997.07.03
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 SAKEMI, SHOJI
分类号 B23P19/00;B23K3/06;B23K31/02;B23P19/04;B23P21/00;B25J15/06;H01L21/00;H01L21/60;H01L23/12;H01L23/544;H05K1/02;H05K3/34;(IPC1-7):H05K3/30 主分类号 B23P19/00
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