发明名称 MULTILAYER PRINTED BOARD AND ITS LAMINATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a multilayer printed board which is hardly warped, twisted, and changed in dimensions and a method of manufacturing the same. SOLUTION: A fiber body 11 is impregnated with a resin component 12 and cured into a prepreg 10, and the prepregs 10 are laminated on a circuit board 20 for the formation of a multilayer printed board, where the prepregs are laminated by making the fiber bodies 11 of the prepregs 10 differ from each other in the direction of fiber. A plurality of prepregs 10 which are formed of fiber bodies 11 impregnated with resin are laminated through a certain lamination method on a circuit board for the formation of a multilayer printed board, where the lamination method is that the fiber bodies 11 of the prepregs 10 are laminated by making the fiber bodies 11 of the prepregs 10 differ from each other in the direction of fiber.
申请公布号 JP2002158442(A) 申请公布日期 2002.05.31
申请号 JP20000352676 申请日期 2000.11.20
申请人 NIPPON MEKTRON LTD 发明人 AZEYANAGI KUNIHIKO;ISHIKAWA NAOTO
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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