| 摘要 |
An optical interface arrangement includes a tile carrying an optical component which is mounted substantially at right angles to a closely adjacent circuit board which carries an electrical circuit. The circuit board has an electrically conductive track extending to an edge of the board adjacent to an edge of the tile. The edge surface of the tile has a localized recess carrying an electrically conductive material which extends across the thickness of the tile and along a major surface of the tile to connect with the optical component. A short bondwire is provided which links the electrically conductive material in the recess to the adjacent electrically conductive track on the circuit board.
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