| 摘要 |
<p>A system is disclosed. The system includes a printed circuit board (PCB) (200) , a substrate ( 210) mounted on the PCB, an integrated circuit (IC) (220) mounted on the substrate, an optoelectronic sub-assembly (230) mounted on the substrate and coupled to the IC; and a waveguide (245) patterned on the substrate. Optical sub-assembly (230) includes an electrical interconnect (232) , glass substrate (234) and die (236) . Interconnect (232) couples IC (220) to glass substrate (234) and is used to transmit high-speed electrical signals to optoelectronic dies mounted on it. In one embodiment, interconnect (232) is a flexible, high-frequency, PCB. Die (236) is mounted on glass substrate (234) . In one embodiment, die (236) is flip-chip mounted on glass substrate (234) .</p> |
