发明名称 |
Power converter and semiconductor device mounting structure |
摘要 |
An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.
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申请公布号 |
US2006284308(A1) |
申请公布日期 |
2006.12.21 |
申请号 |
US20050554998 |
申请日期 |
2005.11.01 |
申请人 |
DENSO CORPORATION |
发明人 |
HARADA DAISUKE;ISHIYAMA HIROSHI |
分类号 |
H01L23/06;H01L;H02M1/12;H02M1/14;H02M7/00 |
主分类号 |
H01L23/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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