发明名称 LASER TRIMMING METHOD AND APPARATUS
摘要 IN A LASER TRIMMING METHOD WHICH LASER PULSES (17) ARE INTERMITTENTLY IRRADIATED ON A RESISTOR (10), A LASER PULSE IRRADIATION POSITION IS MOVED WITH A CONSTANT SPEED RELEVANTLY TO THE RESISTOR, AND TRIMMING OF THE RESISTOR (10) IS PERFORMED WHILE AN ELECTRICAL RESISTANCE OF THE RESISTOR (10) IS MEASURED. AT THIS TIME, IN THE CASE WHERE A DIFFERENCE BETWEEN THE FINAL TARGET VALUE AND THE MEASURED VALUE DURING LASER TRIMMING OF THE ELECTRICAL RESISTANCE IS DEFINED AS ∆RFM, THE CHANGE OF THE MEASURED ELECTRICAL RESISTANCE PER ONE LASER PULSE IRRADIATION IS DEFINED AS ∆R, AND AN INITIAL SETTING OF THE PAUSE TIME IS DEFINED AS T, WHEN ∆RFM IS GREATER THAN ∆R, THE PAUSE TIME IS DEFINED AS T, AND WHEN ∆RFM IS EQUAL TO OR SMALLER THAN ∆R, THE PAUSE TIME TEND BETWEEN THE IMMEDIATELY PRECEDING LASER PULSE IRRADIATION AND THE NEXT LASER PULSE IRRADIATION IS DETERMINED BY THE FORMULA BELOW.(FIG 3)
申请公布号 MY131491(A) 申请公布日期 2007.08.30
申请号 MYPI20012244 申请日期 2001.05.14
申请人 LASERFRONT TECHNOLOGIES, INC. 发明人 SATOSHI HORIKOSHI
分类号 B23K26/00;B23K26/08;B23K101/36;H01C17/22;H01C17/242;H01L27/01 主分类号 B23K26/00
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