发明名称 |
ANISOTROPIC HEAT SPREADING APPARATUS AND METHOD FOR SEMICONDUCTOR DEVICES |
摘要 |
A heat spreading apparatus for use in cooling of semiconductor devices includes a frame having a plurality of individual cells formed therein, each of the cells configured for filling with a material of selected thermal conductivity therein. The selected thermal conductivity of material within a given one of the cells corresponds to a thermal profile of the semiconductor device to be cooled.
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申请公布号 |
US2008030960(A1) |
申请公布日期 |
2008.02.07 |
申请号 |
US20070872095 |
申请日期 |
2007.10.15 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
EDWARDS DAVID L.;FLEISCHMAN THOMAS;ZUCCO PAUL A. |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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