发明名称 |
Metal core foldover package structures, systems including same and methods of fabrication |
摘要 |
Chip scale packages and assemblies thereof and methods of fabricating such packages including Chip-On-Board, Board-On-Chip, and vertically stacked Package-On-Package modules are disclosed. The chip scale package includes a core member of a metal or alloy having a recess for at least partially receiving a die therein and includes at least one flange member partially folded over another portion of the core member. Conductive traces extend from one side of the package over the at least one flange member to an opposing side of the package. Systems including the chip scale packages and assemblies are also disclosed.
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申请公布号 |
US2008048309(A1) |
申请公布日期 |
2008.02.28 |
申请号 |
US20060511184 |
申请日期 |
2006.08.28 |
申请人 |
CORISIS DAVID J;CHONG CHIN HUI;LEE CHOON KUAN |
发明人 |
CORISIS DAVID J.;CHONG CHIN HUI;LEE CHOON KUAN |
分类号 |
H01L23/02;H01L21/00 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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