发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device becoming normally-off, by optimizing a film thickness and an Al composition ratio for an electron supply layer. SOLUTION: The semiconductor device 10 forms an electron transit layer 17 on a substrate 18 by epitaxial growth, and further forms an electron supply layer 15 on the electron transit layer 17 by epitaxial growth. The electron transit layer 17 and the electron supply layer 15 are formed into a heterojunction structure, and is set to be HEMT, where a two-dimensional gas channel 16 can be formed at the junction interface. The electron supply layer 15 is covered with an insulating film 14, and the source, gate, and drain electrodes 11, 12, 13 are provided. The electron supply layer 15 is formed, by setting the Al composition ratio and film thickness to 10-18[%] and 5-15 [nm], respectively. The manufactured semiconductor device 10 becomes normally-off preventing cracks, or the like from occurring. Accordingly, the semiconductor device 10 can be used as a power device. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010021232(A) 申请公布日期 2010.01.28
申请号 JP20080178785 申请日期 2008.07.09
申请人 CHUBU ELECTRIC POWER CO INC;NAGOYA INSTITUTE OF TECHNOLOGY 发明人 YAMAMOTO NOBUYUKI;SUGIMOTO SHIGEYUKI;EGAWA TAKASHI
分类号 H01L21/338;H01L21/205;H01L29/778;H01L29/812 主分类号 H01L21/338
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