Methods and apparatus for package on package devices

摘要

Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device is formed by connecting a top package and a bottom package together using a plurality of PoP connectors on the bottom package connected to corresponding connectors of the top package. The PoP device further comprises a plurality of dummy connectors contained in the bottom package and not connected to any corresponding connector in the top package.

主权项

1. A device comprising:
a first substrate; a first die attached to a first surface of the first substrate; a second substrate attached to the first substrate, the first die being interposed between the first substrate and the second substrate; one or more signaling connectors interposed between the first substrate and the second substrate; and a plurality of dummy connectors interposed between the first substrate and the second substrate, the plurality of dummy connectors not passing electrical signals between the first substrate and the second substrate, the plurality of dummy connectors being connected to only one of first substrate and the second substrate, wherein a first dummy connector is a different size than a second dummy connector.