Resin-sealed electronic control device

摘要

The present invention is intended to increase the moisture resistance of a resin-sealed electronic control device. The resin-sealed electronic control device includes: a semiconductor chip; a chip capacitor; a chip resistor; a bonding member; a substrate; a case; a heat radiating plate; a glass coating; and a first sealing material. The glass coating directly covers the electronic circuit formed by the element group including: the semiconductor chip; the chip capacitor; and the chip resistor, the bonding member and the substrate, and is sealed by the first sealing material. By being water impermeable, the glass coating prevents water absorption in the vicinity of the element group, and can prevent an increase in the leak current of the semiconductor chip due to water absorption, and an insulation performance drop such as lowered insulation resistance caused by migration within the element group.

主权项

1. An electronic control device comprising:
a plurality of semiconductor elements; a substrate with the plurality of semiconductor elements mounted thereon; and a resin sealing the substrate and the plurality of semiconductor elements, wherein the semiconductor elements and the substrate are partially covered with a glass coating containing vanadium and tellurium, and wherein the glass coating contains Ag2O, V2O5, and TeO2 in a total content of 75 mass % or more with respect to the total mass of the glass coating.