Module IC package structure and method for manufacturing the same

摘要

A module IC package structure for increasing heat-dissipating efficiency includes a substrate unit, an electronic unit, a package unit, a first heat-dissipating unit and a second heat-dissipating unit. The substrate unit includes a circuit substrate. The electronic unit includes a plurality of electronic components disposed on the circuit substrate and electrically connected to the circuit substrate. The package unit includes a package gel body disposed on the circuit substrate for enclosing the electronic components. The first heat-dissipating unit includes a heat-dissipating base layer disposed on the top surface of the package gel body. The second heat-dissipating unit includes a plurality of heat-dissipating auxiliary layers disposed on the top surface of the heat-dissipating base layer. Whereby, the heat-dissipating efficiency of the module IC package structure can be increased by matching the heat-dissipating base layer and the heat-dissipating auxiliary layers.

主权项

1. A module IC package structure for increasing heat-dissipating efficiency, comprising:
a substrate unit including a circuit substrate; an electronic unit including a plurality of electronic components disposed on the circuit substrate and electrically connected to the circuit substrate; a package unit including a package gel body disposed on the circuit substrate for enclosing the electronic components; a first heat-dissipating unit including a heat-dissipating base layer disposed on the top surface of the package gel body; and a second heat-dissipating unit including a plurality of heat-dissipating auxiliary layers disposed on the top surface of the heat-dissipating base layer; wherein the substrate unit includes a grounding layer disposed inside the circuit substrate and enclosed by the circuit substrate and an inner conductive structure disposed inside the circuit substrate and electrically connected to the grounding layer, wherein the inner conductive structure includes a plurality of inner conductive layers, and each inner conductive layer has a first end directly contacting the grounding layer and a second end opposite to the first end and exposed from an outer surrounding peripheral surface of the circuit substrate, and the electronic components are electrically connected to the grounding layer through the circuit substrate.