Die level chemical mechanical polishing

摘要

A method of polishing a wafer at the die level with a targeted slurry delivery system. The wafer is placed on a wafer carrier exposing the top side of the wafer, the wafer contains a die. The polishing apparatus will polish a portion of the die using a pad that is smaller than the die and the pad is located above the die. A slurry is applied to a portion of the die being polished. Embodiments of the invention provide multiple pads working on the same die.

主权项

1. A method comprising:
placing a wafer on a wafer carrier, wherein a front side of the wafer is exposed and a back side of the wafer is in contact with the wafer carrier, the wafer includes a die having a topographical variation and containing one or more semiconductor devices; polishing a portion of the die using a pad, the pad is smaller than the die, the pad is located above the front side of the wafer containing the die, wherein a bottom surface of the pad comes in contact with the front side of the die; and applying a slurry to the portion of the front side of the die being polished.