Semiconductor device

摘要

A semiconductor device includes a package substrate having a plurality of external connection terminals disposed on a first surface thereof and a plurality of internal connection terminals disposed on a second surface thereof and electrically connected with corresponding one of the external connection terminals, a first semiconductor chip stacked over the second surface of the package substrate and having a first flag pad for providing first information and a first internal circuit for adjusting a parameter by a first correction value in response to the first information provided from the first flag pad, and a second semiconductor chip stacked over the first semiconductor chip and having a second flag pad for providing second information and a second internal circuit for adjusting the parameter by a second correction value in response to the second information provided from the second flag pad.

主权项

1. A semiconductor device comprising:
at least one flag pad configured to provide chip stack information corresponding to a stack sequence of a plurality of semiconductor chips, which are stack-packaged; and an internal circuit configured to adjust a parameter of the semiconductor device based on at least one of the chip stack information provided from the flag pad, wherein the parameter indicates a skew between an external clock signal and a data strobe signal.