METHOD OF MANUFACTURING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component that suppresses the wetting of a conductive liquid, the method includes a step of adhering the conductive liquid to the electronic component.SOLUTION: A method of manufacturing an electronic component includes a step of adhering a conductive solution to a main body 10, and further includes an insertion step of inserting the main body 10 into a mask 200 provided with a hole H3 in which the main body 10 is to be inserted in a manner so that an end portion E1 of the main body 10 is exposed; and a conductivity addition step of immersing the mask 200 with the main body 10 inserted therein in the conductive solution and adhering the conductive solution to the main body 10. An interference T is existed between the hole H3 of the mask 200 and the main body 10 in a direction orthogonal to a vertical direction.SELECTED DRAWING: Figure 15