| 发明名称 | System and method for forming a bonded joint | ||
| 摘要 | A method and apparatus for forming a bonded joint on a composite structure is presented. An apparatus carrying a first workpiece is positioned relative to a second workpiece. A vacuum is applied to the first workpiece and a portion of the second workpiece. A bladder on a first surface of a housing of the apparatus is deflated. Deflating the bladder positions the first workpiece such that adhesive having a desired thickness is positioned between the first workpiece and the second workpiece. The adhesive positioned between the first workpiece and the second workpiece is cured. | ||
| 申请公布号 | US9427911(B1) | 申请公布日期 | 2016.08.30 |
| 申请号 | US201314041188 | 申请日期 | 2013.09.30 |
| 申请人 | THE BOEING COMPANY | 发明人 | Evens Michael Walter;Spalding, Jr. John F.;Watson Megan Nicole;Slocum Allan Joshua;Baldwin Joel Patrick |
| 分类号 | B29C65/00;B32B37/00 | 主分类号 | B29C65/00 |
| 代理机构 | Yee & Associates, P.C. | 代理人 | Yee & Associates, P.C. |
| 主权项 | 1. A method comprising: positioning an apparatus carrying a first workpiece relative to a second workpiece; applying a vacuum to the first workpiece and a portion of the second workpiece; deflating a bladder on a first surface of a housing of the apparatus such that a number of standoffs that extend a first distance from the first surface are caused to contact the second workpiece, wherein deflating the bladder positions the first workpiece such that adhesive having a desired thickness is positioned between the first workpiece and the second workpiece, wherein when deflated, the bladder extends a second distance from the first surface of the housing that is shorter than the first distance; and curing the adhesive positioned between the first workpiece and the second workpiece. | ||
| 地址 | Chicago IL US | ||