Method and system for template assisted wafer bonding

摘要

A method of fabricating a composite semiconductor structure includes providing a substrate including a plurality of devices and providing a compound semiconductor substrate including a plurality of photonic devices. The method also includes dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method further includes providing an assembly substrate, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, aligning the substrate and the assembly substrate, joining the substrate and the assembly substrate to form a composite substrate structure, and removing at least a portion of the assembly substrate from the composite substrate structure.

主权项

1. A method of fabricating a composite semiconductor structure, the method comprising:
providing a first substrate having a device surface and one or more semiconductor devices thereon; providing a second substrate having epitaxial compound semiconductor materials; dicing the second substrate to provide a plurality of compound semiconductor seed dies; bonding at least one of the plurality of compound semiconductor seed dies to the first substrate to form the composite semiconductor structure; and growing epitaxial compound semiconductor layers on the at least one of the plurality of compound semiconductor seed dies.