| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for polishing double-surface of semiconductor wafer which can remarkably improve work efficiency to make contribution to automation from loading to unloading, by controlling enlargement of apparatus and rise of facility cost at the time of polishing both surfaces of semiconductor wafer. <P>SOLUTION: The double-surface polishing apparatus 1 comprises at least two units among a temporary storing box 12 for tentatively storing a wafer W before the polishing by transferring it from a box 11 arranged in a loader 10, a robot arm 31 having a plate type and an absorber type holding means, a gas injecting means 40 for splashing the solution from a carrier 4 and/or a polishing cloth, a holding hole detecting means 50 for detecting the position of holding hole on the basis of the two points at the boundary of the holding hole 5 of carrier and the polishing hole and the center angle for the holding hole, a crack detecting means 68 for detecting crack of wafer under the condition that the polished wafer is held with a transferring robot, and a buffer vessel 62 for tentatively holding the polished wafer. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
