| 摘要 |
PROBLEM TO BE SOLVED: To prevent the generation of a tail at the disconnection of a wire in wire bonding to be operated by forming a pre-ball. SOLUTION: A control part operates the bonding of a ball 24a formed at the top end part of a wire 24 made of gold with a land 23 made of copper plating on a substrate 21, operates the looping of the wire 24 into a recessed shape at a chip 22 side, and moves this only by a distance 20 μm for a wire diameter 30 μm from the center of the bonded ball 24a to an anti-semiconductor chip side. Then, a capillary 15 is allowed to descend on the ball 24a, and the ball 24a is connected with the wire 24 so that a bound part 24c can be formed. Then, the capillary 15 is allowed to ascend to prescribed height, and the wire 24 is cut so that a pre-ball 25 can be formed. |
