| 摘要 |
PURPOSE:To relax the effect caused by thermal expansion of a bonding agent upon a die and a semiconductor chip after having die bonded by separating respectively a die pad section into at least two portions which are identical to each other in area and shape. CONSTITUTION:The current semiconductor device tends to increase the number of I/O pins of semiconductor chips to comply with such demands as higher integration and more enhanced functions. This increases the size of semiconductor chips themselves currently and die. As for die pad-shaped lead frames, however, the heat of a bonding agent generated after having die-bonded, changes an expansion coefficient, thereby warping the die pads or the semiconductor chips. To solve this, a die 2 is divided into at least two parts and an IC chip is loaded in such fashion that it may rest on the divided parts. Therefore, this reduces a contact area and relaxes the effect of thermal expansion of the bonding agent on the die pad 2 and the semiconductor chip after the die bonding.
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