| 摘要 |
PURPOSE:To provide an IC socket capable of sufficiently exhibiting characteristics of a device without deteriorating electric characteristics. CONSTITUTION:First pads 11 in contact with leads 20 of an IC 19 and second pads 12 in contact with inner layer wiring 17 of a board 15 for mounting the IC 19 are respectively disposed on and under a printed circuit board 10. The first pads 11 and the second pads 12 are connected to each other via inner layer wiring 13 of the printed circuit board 10. |
