| 摘要 |
PURPOSE: To simply and easily detect dislocation between a circuit pattern and a solder resist pattern with visual observation without using a scale such as gradation, etc. CONSTITUTION: On a circuit substrate 10 on which a circuit pattern is formed, a solder resist is formed in a specified pattern, and then, when inspecting dislocation between the circuit pattern and solder resist pattern, an error discriminating pattern 11, wherein a plurality of inspecting lands 12 are regularly aligned with constant intervals D1, is formed on the circuit substrate 10. And, when the solder resist is formed on it, a scale pattern 21, formed in such a way that a plurality of inspecting marks 22 are aligned with intervals D2 (=D1-Δt,Δ1 is minimum dislocation detection amount), is so formed as to over lay on the error discriminating pattern 11, and, based on the over lay condition of the inspecting land 12 with the inspection mark, dislocation between the circuit pattern and the solder resist pattern is inspected.
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