| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor sealing epoxy resin composition having no dust due to drop of powder from a tablet during a molding step without generating dust during a manufacturing step without deteriorating various characteristics obtained from the tablet. SOLUTION: In the case of kneading the semiconductor sealing epoxy resin composition containing epoxy resin, phenol resin curing agent, inorganic filler and curing accelerator as indispensable components and 65 to 93wt.% of the filler in the overall composition by using an extruder 1, resin composition 3 extruded in a strand-like state from a nozzle having a sectional area of 9mm<2> or less at 70 to 120 deg.C of a resin temperature is cut in a length of 3mm or less, then pressurized to be compressed by punches 5, 6 by desired weight correspondence and shaped to a tablet state. |
