| 摘要 |
<p>A flexible skin formed of silicon islands (222) encapsulated in a polyimide film (214, 224). The silicon islands (222) preferably include a MEMS device and are connected together by a polyimide film (214, 222) (preferably about 1-100 νm thick). To create the silicon islands (222), silicon wafers (202) are etched to a desirable thickness (preferably about 10-500 νm) by Si wet etching and then patterned from the back side (200) by reactive ion etching (RIE).</p> |
