| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding device capable of accurately performing a flattening process, in accordance with the finishing of a semiconductor device or a thin film magnetic head, etc. SOLUTION: A grinding device 1 is equipped with plural, e.g. three, grinding parts 11A-11C, and a cleaning part 11D. At first in the grinding part 11A, rough grinding is made by a surface plate 12a composed of a hard grinding wheel, and at that time, the pattern dependency of a wafer is not seen on a grinding surface because of the hard grinding surface of the surface plate 12a. Next in the grinding part 11B, a scratch or abrasive distorsion, slightly occurring in the wafer in the surface plate 12a, is removed (half-ground) by a hard grinding pad 13b having single layer structure, and successively grinding is finished by a grinding pad 13c having two layer structure in the grinding part 11C. Finally in the cleaning part 11D, a microscratch occurring in former processes or a contaminant by a slurry are completely washed away by a cleaning pad 13d in the cleaning part 11D. |
