发明名称 WAFER POSITIONING APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To obtain a wafer positioning apparatus wherein a wafer can be positioned properly on a sample table even when the wafer or the sample table is charged electrostatically. SOLUTION: When positioning a wafer 1 by putting it on a sample table 3, an end 4a of a wafer receiver 17 (lever mechanism) 4 is contacted with one portion of the wafer 1 at an upper point than the top surface of the sample table 3 to receive the wafer 1. In this state, a pressing mechanism 5 presses the wafer 1 against a wafer positioning pin 2 to position the wafer 1. Thereafter, the end 4a of the wafer receiver 4 descends (moves) to put the wafer 1 on the top surface of the sample table 3.</p>
申请公布号 JP2000183136(A) 申请公布日期 2000.06.30
申请号 JP19980354029 申请日期 1998.12.14
申请人 HITACHI LTD 发明人 SATO SEISHIRO;FUKUSHIMA YOSHIMASA;TSUNODA MASAHIRO;MATSUSHIMA MASARU
分类号 H01L21/68;H01L21/027;(IPC1-7):H01L21/68 主分类号 H01L21/68
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