| 摘要 |
An optical interface between circuit cards, more particularly between optical paths on a circuit card and a mainboard, is manufactured using bulk silicon micromachining technology. Silicon components of the interface are chemically etched and mass produced at a reduced cost for a higher degree of accuracy and precision than is available for mechanically produced interfaces. By use of micromachining technology to manufacture mating components of an interface, dimensional tolerances are possible which cannot be produced with conventional machining techniques. The resulting interface includes a pair of micromachined silicon substrates for mounting on a pair of circuit cards, each of the substrates having fiducial features, detents or cavities for aligning with the other substrate and thereby for aligning the two circuit cards. The optical path on a first circuit card may include an optical fiber mounted thereon. The silicon substrate mounted on a second circuit card includes a chemically etched cavity for a spherical lens, the cavity being aligned with the other fiducial features, detents or cavities etched therein, and thus being aligned with the optical path on the first circuit card. The interface further provides alignment pivots, which may be spherical lenses, within cavities micromachined in the substrates to implement self alignment of the substrates and hence of the circuit cards.
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