Light sensing system with high pixel fill factor

摘要

The invention is an imaging device having a high fill factor. The high fill factor is achieved by constructing the light sensors in a vertical fashion in the imaging device. The control circuitry of the light sensor is then contained inside the integrated circuit chip, rather than taking up area that could otherwise be used for light collection. The majority of the area on the surface of the IC chip is made up of light sensing elements, since the control circuitry is embedded in the IC chip. The control circuitry is connected to the light sensing devices through vias in the IC chip. The control circuitry of the chip is mainly contained within the die, rather than on it.