| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor-module mounting structure, capable of superior preventing the intrusion of air into grease openings among metallic heat sinks and heat-receiving members regardless of the repetition of the expansion and contraction of a semiconductor module, in the semiconductor-module mounting structure, in which the semiconductor module having the metallic heat sinks on both main surfaces is held directly or via insulating sheets by a pair of the heat-receiving members. <P>SOLUTION: The metallic heatsinks 3 and 4 are exposed from both main surfaces of the semiconductor module, while being surrounded by resin-sealing sections 11, and the metallic heat sinks 3 and 4 are faced to the heat-receiving members 7 and 8 through the insulating sheets 5 and 6 or directly. The openings among the heat sinks 3 and 4 and the insulating sheets 5 and 6 are coated with grease. Even in the openings among the heat-receiving members 7 and 8 and the insulating sheets 5 and 6 are also coated with grease. Since grease-collecting sections 14 are formed to the surfaces of the resin-sealing sections 11 while surrounding the heatsinks 3 and 4, the outside air is difficult to intrude among the heat sinks 3 and 4 and the insulating sheets 5 and 6, even if grease moves in the face direction by expansion/contraction cycle in the thickness direction of the semiconductor module. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
