| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a problem in a conventional double-sided polishing device provided with a washing nozzle and a separating device, wherein a stain remains on a semiconductor wafer finished with polishing in spite of being washed, and to positively hold the wafer into a holding hole of a carrier after polishing is completed. <P>SOLUTION: The double-sided polishing device is provided with a sun gear 2, an internal gear 3, carriers 81-85, an upper surface table 5 and a lower surface table 4, a slurry feeder 63 and a washing liquid feeder. During washing between the upper and lower surface tables, the washing liquid is jetted also from a separating nozzle 71 in addition to a slurry nozzle 61. Coagulated slurry stuck into the separating nozzle 71 during polishing is thereby washed to prevent the stain of a workpiece caused by the collision of the coagulated slurry included in the separating gas when lifting the upper surface table 5, and to prevent the workpiece from floating with the washing liquid left on the lower surface table 4 when indexing for unloading. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
