发明名称 |
STEUEURUNG VON LASERBEARBEITUNG |
摘要 |
<p>A UV laser beam is used to machine semiconductor. The beams intensity (IB) is chosen so that it lies in a range of such values for which there is an increasing (preferably linear) material removal rate for increasing IB An elongate formation such as a trough or a slot is machined in n scans laterally offset (O_centre), for each value of z-integer in the z direction.</p> |
申请公布号 |
DE60124938(T2) |
申请公布日期 |
2007.09.20 |
申请号 |
DE2001624938T |
申请日期 |
2001.10.26 |
申请人 |
XSIL TECHNOLOGY LTD. |
发明人 |
BOYLE, ADRIAN;DUNNE, KALI;FARSARI, MARIA |
分类号 |
B23K26/402;B23K101/40;H01L21/301 |
主分类号 |
B23K26/402 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|