发明名称 |
Chemical mechanical polishing compositions and methods relating thereto |
摘要 |
A method for chemical mechanical polishing of semiconductor substrates containing a metal layer requiring removal and metal interconnects utilizing a composition containing engineered copolymer molecules comprising hydrophilic functional groups and relatively less hydrophilic functional groups; the engineered copolymer molecules enabling contact-mediated reactions between the polishing pad surface and the substrate surface during CMP resulting in minimal dishing of the metal interconnects in the substrate.
|
申请公布号 |
US7300874(B2) |
申请公布日期 |
2007.11.27 |
申请号 |
US20050077671 |
申请日期 |
2005.03.10 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. |
发明人 |
WEINSTEIN BARRY;GHOSH TIRTHANKAR |
分类号 |
B24B37/00;H01L21/302;C09G1/02;C09K3/14;H01L21/304;H01L21/321;H01L21/461 |
主分类号 |
B24B37/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|