| 摘要 |
PROBLEM TO BE SOLVED: To reduce separation of a via conductor. SOLUTION: The wiring board comprises a base 11 formed of ceramic, and a first conductor layer 12a and a second conductor layer 12b. The base 11 includes a through hole 11h in addition to a first surface 11a and a second surface 11b. The first conductor layer 12a is formed of active metal, and is formed on an end part of the through hole 11h on a first surface 11a side. The second conductor layer 12b is formed of the active metal, and is formed on an end part of the through hole 11h on a second surface 11b side. The wiring board is formed of group 11 metal material, and has a third conductor layer 12c formed between the first conductor layer 12a and the second conductor layer 12b in the through hole 11h. COPYRIGHT: (C)2009,JPO&INPIT
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