| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat module having a high cooling characteristics of a heat source, while achieving reduction in size of and an electronic equipment.SOLUTION: A heat module includes a fan and a duct of which a part is thermally contactable with at least one of heat sources, and a housing of the heat module includes a side wall part 32, having: an upside plate part that rotatably supports an impeller 4 through a motor; an exhaust port 36 that covers a side direction of the impeller 4, and of which at least one region of a circumferential direction is opened to an outer space of the fan; and a tongue part 321 that projects to a gap between the exhaust port 36 and the impeller 4. The duct has a flow path that is fixed to a bottom edge of the side wall part 32, and flows in a direction perpendicular to a central axis J1, and an intake port 36 at a position opposite to the impeller in an axial direction. A first virtual straight line 71 that passes through the central axis J1 in parallel to a direction that a fluid is flown in the duct passes through a side opposite to the tongue part 321 as a reference of a second virtual straight line 72 that passes through the central axis J1 and is perpendicular to the exhaust port 36 in the side of exhaust port 36 from the central axis J1.SELECTED DRAWING: Figure 3 |
