SEMICONDUCTOR PACKAGE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide the semiconductor package of a stacked multi-die and its manufacturing method.

SOLUTION: A semiconductor package manufacturing method includes a process of arranging a laminate of semiconductor dies 182 and 180 on a substrate 184. The lamination is formed in such a form that the edge 204 of the upper semiconductor die 182 is projected from the lower semiconductor die to form a recess. Support adhesive layers 190, 192, and 194 comprising a filler 208 are arranged in the circumference of the edge 210 of the lower semiconductor die 180 on the substrate 184 to fill the recess. The filler 208 comprises microspheres.

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