Methods and materials for anchoring gapfill metals

摘要

One aspect of the present invention includes a method of fabricating an electronic device. According to one embodiment, the method comprises providing a substrate having dielectric oxide surface areas adjacent to electrically conductive surface areas, chemically bonding an anchor compound with the dielectric oxide surface areas so as to form an anchor layer, initiating the growth of a metal using the electrically conductive surface areas and growing the metal so that the anchor layer also bonds with the metal. The anchor compound has at least one functional group capable of forming a chemical bond with the oxide surface and has at least one functional group capable of forming a chemical bond with the metal. Another aspect of the present invention is an electronic device. A third aspect of the present invention is a solution comprising the anchor compound.

主权项

1. A solution to increase the bonding between an oxide surface and a gapfill metal, the solution comprising:
an amount of water-soluble solvent; an amount of anchor compound having at least one functional group capable of forming a chemical bond with the oxide surface and having at least one functional group capable of forming a chemical bond with the gapfill metal, wherein the anchor compound comprises inorganic oxoanions having the generic formula AXOYZ−wherein, A is a chemical element, O is oxygen, X is an integer, Y is an integer, and Z is an integer; and an amount of water.