Power supply arrangement for semiconductor device

摘要

A semiconductor device includes a device die, a first power supply die, and a second power supply die different from the first power supply die. The device die includes a first circuit and a second circuit. The first power supply die is electrically coupled to the first circuit and configured to supply power for the first circuit. The second power supply die is electrically coupled to the second circuit and configured to supply power for the second circuit. The first and second power supply dies are attached to the device die, and overlap the device die in a thickness direction of the device die.

主权项

1. A semiconductor device, comprising:
a device die comprising a first circuit and a second circuit; an interposer comprising a first surface, a second surface opposite to the first surface, and a plurality of through vias extending from the first surface to the second surface, the device die being attached to the first surface of the interposer; a first power supply die attached to the second surface of the interposer, electrically coupled to the first circuit through the interposer, and configured to supply power for the first circuit; and a second power supply die different from the first power supply die, the second power supply die attached to the second surface of the interposer, electrically coupled to the second circuit through the interposer, and configured to supply power for the second circuit, wherein the first and second power supply dies overlap the device die in a thickness direction of the device die.