| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module which is excellent in connection reliability even if a junction temperature becomes high.SOLUTION: Disclosed is a semiconductor module having a configuration in which a semiconductor chip 101 equipped with a surface electrode and a back electrode is mounted on a circuit board. This semiconductor module includes: a first sinter junction layer 105 in which a back electrode 106' of the semiconductor chip and wiring 102 of the circuit board are connected; and a second sinter junction layer 105' in which the surface electrode 106 of the semiconductor chip and a conductive plate 150 are connected. The rigidity of the first sinter junction layer 105 is higher than that of the second sinter junction layer 105'.SELECTED DRAWING: Figure 2 |
