| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting structure for a semiconductor device which prevents damage to connection reliability between a semiconductor chip and a wiring board even if more minute flip-chip mounting is carried out. <P>SOLUTION: According to the mounting structure, first ball bumps 13 made of Au wires are formed on conductive pads 12 formed on a wiring board 11. Second bumps 16, which are made of Au wires having hardness different from that of the first ball bumps 13, are formed on conductive pads 15 formed on a semiconductor chip 14. The wiring board 11 and the semiconductor chip 14 are bonded together with a sealing resin 17. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
