| 发明名称 |
Methods of forming transfer films |
| 摘要 |
Methods of making transfer films to form bridged nanostructures are disclosed. The methods include applying a thermally stable backfill layer to a structured surface of a sacrificial template layer. |
| 申请公布号 |
US9419250(B2) |
申请公布日期 |
2016.08.16 |
| 申请号 |
US201514959770 |
申请日期 |
2015.12.04 |
| 申请人 |
3M Innovative Properties Company |
发明人 |
Schwartz Evan L.;Meyer Justin P.;Benson Olester;Collier Terry O.;Free Michael Benton;Kamrath Robert F.;Mazurek Mieczyslaw H.;Olson David B.;Shenoy K. Raveesh;Wolk Martin B. |
| 分类号 |
H01L51/52;B32B3/26;B32B27/30;B32B37/18;B32B38/00;B32B38/06;G03F7/09;B29D11/00;H01L51/00;B32B38/18;B32B37/12;B29K83/00 |
主分类号 |
H01L51/52 |
| 代理机构 |
|
代理人 |
Kollodge Jeffrey S. |
| 主权项 |
1. A method of forming a transfer film, comprising:
applying a thermally stable backfill layer to a structured surface of a sacrificial template layer, the thermally stable backfill layer conforms to the structured surface of the sacrificial template layer and comprises thermally stable molecular species; and allowing a portion of the thermally stable molecular species to migrate into the sacrificial template layer to form the transfer film. |
| 地址 |
St. Paul MN US |
