发明名称 FILM DEPOSITION METHOD AND FILM DEPOSITION APPARATUS OF CARBON FILM
摘要 PROBLEM TO BE SOLVED: To provide a film deposition method of a carbon film that hardly causes reaction damage to a workpiece or a treatment chamber during production processing, even when chlorine gas is used for lowering thermal decomposition temperature in film deposition of a carbon film.SOLUTION: A film deposition method of a carbon film includes a step (step 2) for depositing a carbon film on the surface to be treated of a workpiece and a step for thermal treatment of the workpiece. In the step for depositing a carbon film, a hydrocarbon-based carbon source gas and chlorine gas for lowering thermal decomposition temperature of the hydrocarbon-based carbon source gas are supplied to the workpiece to deposit the carbon film on the surface to be treated of the workpiece at a temperature lower than the thermal decomposition temperature of the hydrocarbon-based carbon source gas itself. In the step for thermal treatment, the workpiece on which the carbon film is deposited is supplied with nitrogen gas, hydrogen gas, or a gas containing nitrogen and hydrogen to subject the workpiece on which the carbon film is deposited to thermal treatment at a temperature higher than the film deposition temperature.SELECTED DRAWING: Figure 1
申请公布号 JP2016153518(A) 申请公布日期 2016.08.25
申请号 JP20150031558 申请日期 2015.02.20
申请人 TOKYO ELECTRON LTD 发明人 KITAMURA MASAYUKI;MIZUNAGA SATORU;SHIMIZU AKIRA;KAKIMOTO AKINOBU
分类号 C23C16/26;C01B31/02;C23C16/01;C23C16/56;H01L21/3065 主分类号 C23C16/26
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