发明名称 Molding packaging material
摘要 A molding packaging material including a matte coat layer having excellent formability, chemical resistance, solvent resistance, and printability is provided. The molding packaging material 1 includes an outer base material 13 made of a heat-resistant resin, an inner sealant layer 16 made of a thermoplastic resin, a metal foil layer 11 arranged between the outer base material 13 and the inner sealant layer 16, and a matte coat layer 14 formed on one side of the outer base material opposite to the other side thereof to which the metal foil layer 11 is arranged. The matte coat layer 14 is made from a resin composition containing a base compound resin including a phenoxy resin and a urethane resin, a curing agent, and solid fine particles.
申请公布号 US9502695(B2) 申请公布日期 2016.11.22
申请号 US201414269270 申请日期 2014.05.05
申请人 Showa Denko Packaging Co., Ltd. 发明人 Minamibori Yuji
分类号 H01M2/02;B32B15/092;B32B15/095 主分类号 H01M2/02
代理机构 Keating and Bennett, LLP 代理人 Keating and Bennett, LLP
主权项 1. A molding packaging material comprising: an outer base material made of a heat-resistant resin; an inner sealant layer made of a thermoplastic resin; a metal foil layer arranged between the outer base material and the inner sealant layer; and a matte coat layer formed on one side of the outer base material opposite to the other side thereof on which the metal foil layer is arranged; wherein the matte coat layer is made of a resin composition containing a base compound resin including a phenoxy resin and a urethane resin, a curing agent, and solid fine particles, a mass ratio of the phenoxy resin and the urethane resin in the base compound resin is 0.6 to 1.6 urethane resin to 1 phenoxy resin, an average particle size of the solid fine particles is 1 to 10 μm, a content rate of the solid fine particles in the resin composition is 0.1 to 60% by weight, the curing agent is an isocyanate component, and a blending amount of the curing agent is 5 to 30 mass parts to 100 mass parts of the base compound resin.
地址 Kanagawa JP