发明名称 Compound semiconductor device having gallium nitride gate structures
摘要 The present disclosure provides a semiconductor structure. The semiconductor structure includes a buffer layer on a substrate, an graded aluminum gallium nitride (AlGaN) layer disposed on the buffer layer, a gallium nitride (GaN) layer disposed on the graded AlGaN layer, a second AlGaN layer disposed on the GaN layer and a gate stack disposed on the second AlGaN layer. The gate stack includes one or more of a III-V compound p-doped layer, a III-V compound n-doped layer, an aluminum nitride (AlN) layer between the III-V compound p-doped and n-doped layers, and a metal layer formed over the p-doped, AlN, and n-doped layers. A dielectric layer can also underlie the metal layer.
申请公布号 US9502524(B2) 申请公布日期 2016.11.22
申请号 US201514724876 申请日期 2015.05.29
申请人 Taiwan Semiconductor Manufacturing Co., Ltd. 发明人 Hsiung Chih-Wen
分类号 H01L29/15;H01L21/3205;H01L29/66;H01L21/76;H01L29/20;H01L29/778;H01L27/06;H01L29/51;H01L21/02;H01L21/285;H01L21/8252;H01L29/201;H01L29/205;H01L29/207 主分类号 H01L29/15
代理机构 Duane Morris LLP 代理人 Duane Morris LLP
主权项 1. A method of forming a semiconductor structure comprising the steps of: forming an aluminum gallium nitride layer (AlGaN) on a GaN layer; and forming a first gate stack on the AlGaN layer, the first gate stack including: a III-V compound p-type doped layer adjacent the AlGaN layer,an aluminum nitride (AlN) layer disposed on the III-V compound p-type doped layer,a III-V compound n-type doped layer disposed on the AlN layer,a metal layer disposed on the III-V compound n-type doped layer; and forming a second gate stack disposed on the AlGaN layer, the second gate stack being different from the first gate stack.
地址 Hsin-Chu TW