发明名称 Semiconductor device and method of manufacturing the same
摘要 A semiconductor device includes: a first member including a selection transistor on a front surface side of a first substrate; and a second member including a resistance change device and a connection layer that comes in contact with the resistance change device, the connection layer being bonded to a back surface of the first member.
申请公布号 US9502467(B2) 申请公布日期 2016.11.22
申请号 US201414282009 申请日期 2014.05.20
申请人 SONY CORPORATION 发明人 Shoji Mitsuharu;Fujiwara Ichiro
分类号 H01L29/82;H01L43/00;H01L27/22;H01L43/12 主分类号 H01L29/82
代理机构 Dentons US LLP 代理人 Dentons US LLP
主权项 1. A semiconductor device, comprising: a first member including first and second transistors on a front surface side of a first semiconductor substrate, the first transistor being a memory selection transistor, the second transistor being other than a memory selection transistor; and a second member including an insulating layer in which are embedded first and second resistance change devices, a conductive layer, and first and second connection layer portions, the first connection layer portion connecting the first resistance change device with the first transistor, the second connection layer portion connecting the second resistance change device with the second transistor, the first and second resistance change devices being commonly connected to the conductive layer, the insulating layer of the second member being bonded to the semiconductor substrate at a back surface of the first member.
地址 Tokyo JP