| 摘要 |
The invention relates to a dual module for a dual chip card, which includes a supporting film 7 supporting on an outer surface a plurality of connecting pads (C1-C8) including two series of connecting pads extending in a given direction and, on an inner surface, two inner connection areas (9) intended for being connected to an antenna of said dual card and a chip 6, said chip including contact terminals connected by wires respectively to the inner connection areas or to certain electric connecting pads by means of holes (41-45) passing through said supporting film while being coated, together with said wires, by a mass of coating resin, characterised in that the series of electric connecting pads of the outer surface include only three pads (C1-C3, C5-C7) and in that each of the two inner connection areas forms a comb (20, 30) including a body extending under each of the pads of one of the two series of connecting pads separated from the coating mass, respectively, and blades, including two end blades starting at the ends of the body (20A-D, 30A-D), which extend separately from one another from said body until ends covered by the coating mass. |
