Systems and methods for semiconductor line scribe line centering

摘要

Methods and systems for semiconductor line scribe centering are provided. A method includes placing and measuring substantially identical test macros within a chip and in a scribe line. The method also includes establishing an estimate correlation between scribe line measurements taken during a manufacturing process and product measurements taken on a final product. The method also includes determining empirical scribe line specification limits consistent with established product screen limits. The method also includes adjusting the manufacturing process in order to optimize performance to the empirical scribe line specification limits.

主权项

1. A method, comprising:
placing and measuring substantially identical test macros within a chip and in a scribe line; establishing an estimate correlation between scribe line measurements taken during a manufacturing process and product measurements taken on a final product; and determining empirical scribe line specification limits consistent with established product screen limits, wherein the establishing an estimate correlation is a regression line analysis between scribe line measurements and the measurements of the final products, and wherein:
a range enclosed by the scribe line specification limits defines an acceptable scribe line range,a range enclosed by product specification limits defines an acceptable product range, intersections between the scribe line specification limits and the product specification limits define specification limit corners, and further comprising:adjusting the empirical scribe line specification limits when the estimate correlation does not intersect the specification limit corners, andadjusting the manufacturing process to optimize performance to the empirical scribe line specification limits.