| 摘要 |
PROBLEM TO BE SOLVED: To device equalization of optical property and prevention of a bonding wire from exposure by providing an oil-repellent film along the periphery of light-transmitting resin on an upper surface of a substrate. SOLUTION: An LED chip 31 is provided on an upper surface of a substrate 21. An LED light source is made by molding the LED chip 31 with light- transmitting resin 33, and is provided with an oil-repellent film 26 along the a periphery of the light-transmitting resin 33 on the upper surface of the substrate 21. For example the oil-repellent film 26 is formed of oil-repellent, mainly canting silicon or polymer of fluorine base. The LED chip 31 is bonded and fixed to a chip arranging pad 22a of a pad 22 for LED on the substrate 2 via a conductive bonding agent. Next, a bonding wire is connected by wire bonding between the LED chip 31 and the pad 22b for wire bonding. Then a predetermined volume of the light-transmitting resin 33 in a fluid state is made to drip from the upper part of the LED chip 31. Following that, the resin 33 which is prevented from expanding by the oil-repellent film 26 undergoes heat processing and is hardened. |
