Fabrication of a semi-flexible printed circuit with a metal heat dissipation substrate, incorporating some hollowed zones, using conventional rigid circuit fabrication techniques

摘要

Fabrication of a semi-flexible printed circuit with heat dissipation comprises : (a) the fabrication of a printed circuit incorporating an insulating substrate (2), a conducting layer (3) and a metal heat dissipation substrate (1), the conducting layer and the insulating substrate forming a flexible circuit; (b) the cutting out of the printed circuit. The metal substrate includes some hollowed zones (11). An independent claim is also included for: the semi-flexible printed circuit obtained.