Method and apparatus for measuring flatness and/or relative angle between top and bottom surfaces of a chip

摘要

A system and method for obtaining metrics of a semiconductor chip are provided. A first surface of a chip is positioned on a substantially flat receiving surface. A topography of the receiving surface is measured. A topography of a second surface of the chip is also measured. A relative angle between the receiving surface and the second surface of the chip are determined using the measurements of the receiving surface and the second surface of the chip.